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  1. Friedrich-Alexander-Universität
  2. Technische Fakultät
  3. Department Elektrotechnik-Elektronik-Informationstechnik
Friedrich-Alexander-Universität Institute for Electronics Engineering LTE
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MassiveData6G

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MassiveData6G

Entwurf hochperformanter RF-Komponenten

(Third Party Funds Group – Sub project)

Titel des Gesamtprojektes: Erforschung innovativer Mikrochipkomponenten für höchste Datenübertragungsraten im nächsten Mobilfunkstandard - ForMikro-MassiveData6G

Projektstart: 01/10/2019
Akronym: MassiveData6G
Mittelgeber: Bundesministerium für Bildung und Forschung (BMBF)

Abstract

The ever-increasing number of agile Internet users and the concomitant growth in data volumes, driven in particular by the use of mobile Internet, video and cloud streaming services ("streaming on demand"), are already causing bandwidth bottlenecks in existing data and mobile communication systems. The MassiveData6G project aims to address the emerging bandwidth constraints in infrastructure to provide at least 100 Gbps per mobile user in the future. The required low-power and low-cost 140 GHz transceiver uses a MIMO architecture with at least 5 GHz signal bandwidth and high spectral efficiency (512/1024 QAM signal modulation). In addition, to address the mass market, this project uses a low cost, low power 22-nanometre FDSOI (Fully Depleted Silicon On Insulator) CMOS technology (22FDX), which not only allows a high performance implementation of the digital signal processing components, but is also perfectly suited for the 140 GHz RF components.

Publikationen

2024

  • Huang T., Hetterle P., Engelmann A., Probst F., Schrotz AM., Weigel R., Fischer G.:
    A 1.7 dBm OP1dB D-Band Up-Conversion Mixer Utilizing Adaptive Back-Gate Bias in 22 nm FDSOI
    2024 Asia-Pacific Microwave Conference (Bali)
    BibTeX: Download

2023

  • Hetterle P., Engelmann A., Probst F., Huang T., Weigel R.:
    A Low Voltage Folded Gilbert Cell Mixer for 6G Communication Systems
    Asia-Pacific Microwave Conference (APMC) (Taipei International Convention Center (TICC) Address: No. 1, Section 5, Xinyi Road, Taipei City, 05/12/2023 - 08/12/2023)
    DOI: 10.1109/APMC57107.2023.10439846
    BibTeX: Download
  • Huang T., Engelmann A., Hetterle P., Probst F., Weigel R.:
    A 3-Stacked 10.2 dBm OP1dB D-Band Power Amplifier in 22 nm FDSOI for 6G Communication
    2023 Asia-Pacific Microwave Conference (Taipei, 05/12/2023 - 08/12/2023)
    DOI: 10.1109/APMC57107.2023.10439861
    BibTeX: Download

2022

  • Hetterle P., Engelmann A., Probst F., Weigel R., Dietz M.:
    Design of a Low Voltage D-band LNA in 22 nm FDSOI
    European Microwave Integrated Circuits Conference (Allianz MiCo Piazzale Carlo Magno, 1 20149 Milano, 26/09/2022 - 27/09/2022)
    In: 17th European Microwave Integrated Circuits Conference (EuMIC) 2022
    DOI: 10.23919/EuMIC54520.2022.9923520
    URL: https://ieeexplore.ieee.org/document/9923520
    BibTeX: Download

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